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MPX5010
Sensors
Freescale Semiconductor, Inc. 9
Pressure
PACKAGE DIMENSIONS
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MILLIMETERSINCHES
0.100 BSC 2.54 BSC
DIM
A
B
C
D
G
J
K
M
N
S
MIN
0.415
0.415
0.210
0.026
0.009
0.100
0˚
0.405
0.540
MAX
0.425
0.425
0.220
0.034
0.011
0.120
15˚
0.415
0.560
MIN
10.54
10.54
5.33
0.66
0.23
2.54
0˚
10.29
13.72
MAX
10.79
10.79
5.59
0.864
0.28
3.05
15˚
10.54
14.22
PIN 1 IDENTIFIER
K
SEATING
PLANE
-T-
DETAIL X
S
G
4
5
8
1
-A-
-B-
C
M
J
N
D
8 PL
S
B
M
0.25 (0.010) A
S
T
DETAIL X
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).
ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 12.700.5200.500 13.21
D 0.660.0340.026 0.864
G 0.100 BSC 2.54 BSC
J 0.009 0.011 0.23 0.28
K 0.100 0.120 2.54 3.05
M 0 15 0 15
N 0.444 0.448 11.28 11.38
S 0.540 0.560 13.72 14.22
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5
TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
PIN 1
K
SEATING
PLANE
–T–
S
G
4
5
8
1
–A–
–B–
C
N
V
W
M
J
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17
IDENTIFIER
D 8 PL
S
B
M
0.25 (0.010) A
S
T
DETAIL X
DETAIL X
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