TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 160 Pin |
Case/Package | CSP-BGA |
Number of Outputs | 1 Output |
Number of Channels | 1 Channel |
Number of Bits | 14 Bit |
Power Dissipation | 550 mW |
Resolution (Bits) | 14.0 Bit |
Operating Temperature (Max) | 85 ℃ |
Operating Temperature (Min) | -40 ℃ |
Power Dissipation (Max) | 550 mW |
Number of DACs | 1 DAC |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tray |
Operating Temperature | -40℃ ~ 85℃ |
Pin-compatible family Excellent dynamic performance AD9736: SFDR = 82 dBc at fOUT = 30 MHz AD9736: SFDR = 69 dBc at fOUT = 130 MHz AD9736: IMD = 87 dBc at fOUT = 30 MHz AD9736: IMD = 82 dBc at fOUT = 130 MHz LVDS data interface with on-chip 100 Ω terminations Built-in self test LVDS sampling integrity LVDS-to-DAC data transfer integrity Low power: 380 mW (IFS = 20 mA; fOUT = 330 MHz) 1.8/3.3 V dual-supply operation Adjustable analog output 8.66 mA to 31.66 mA (RL = 25 Ω to 50 Ω) On-chip 1.2 V reference 160-lead chip scale ball grid array (CSP_BGA) package
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