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BGA2011
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BGA2011 Datasheet PDF - NXP

Manufacturer:NXP
Category:Amplifier ICs & Modules
Case Package:SOT-363
Description:RF Amp Chip Single GP 900MHz 4.5V 6Pin TSSOP
Documentation:BGA2011 Datasheet (12 Pages)Pinout Diagram on2 PageHot
Package Outline Dimension on9 Page
Pictures:
Symbol
Footprint
Pinout
Product Pictures
BGA2011 Datasheet PDF (12 Pages)
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BGA2011 Specifications

TYPEDESCRIPTION
Mounting StyleSurface Mount
Number of Pins6 Pin
Case/PackageSOT-363
Operating Temperature (Max)150 ℃
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BGA2011 Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusUnknown
Size-Length2.2 mm
Size-Width1.35 mm
Size-Height1 mm
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BGA2011 Documents

BGA2011 Datasheet
NXP
12 Pages / 0.08 MByte
BGA2011 Other Datasheet PDF
NXP
12 Pages / 0.3 MByte
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