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BGA2711
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BGA2711 Datasheet PDF - NXP

Manufacturer:NXP
Category:Amplifier ICs & Modules
Case Package:TSSOP-363
Description:RF Amp Chip Single GP 6V 6Pin TSSOP
Documentation:BGA2711 Datasheet (12 Pages)Pinout Diagram on2 PageHot
Package Outline Dimension on8 Page
Pictures:
Symbol
Footprint
Pinout
Product Pictures
BGA2711 Datasheet PDF (12 Pages)
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BGA2711 Specifications

TYPEDESCRIPTION
Mounting StyleSurface Mount
Number of Pins6 Pin
Case/PackageTSSOP-363
Output Power1.8 dBm
Operating Temperature (Max)150 ℃
3dB Bandwidth3600 MHz
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BGA2711 Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusUnknown
Size-Length2.2 mm
Size-Width1.35 mm
Size-Height1 mm
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BGA2711 Documents

BGA2711 Datasheet
NXP
12 Pages / 0.07 MByte
BGA2711 Other Datasheet PDF
NXP
11 Pages / 0.29 MByte
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