| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 8 Pin |
| Voltage Rating (DC) | 55.0 V |
| Current Rating | 5.00 A |
| Case/Package | P-DSO-8 |
| Number of Channels | 2 Channel |
| Number of Positions | 8 Position |
| Drain to Source Resistance (on) (Rds) | 0.031 Ω |
| Polarity | N-CH |
| Power Dissipation | 2 W |
| Threshold Voltage | 1.2 V, 1.2 V |
| Input Capacitance | 870 pF |
| Gate Charge | 26.0 nC |
| Drain to Source Voltage (Vds) | 55 V |
| Continuous Drain Current (Ids) | 5.00 A |
| Rise Time | 8 ns |
| Input Capacitance (Ciss) | 870pF @25V(Vds) |
| Input Power (Max) | 2 W |
| Fall Time | 8 ns |
| Operating Temperature (Max) | 150 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Power Dissipation (Max) | 2000 mW |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Size-Length | 4.9 mm |
| Size-Width | 3.9 mm |
| Size-Height | 1.75 mm |
| Operating Temperature | -55℃ ~ 150℃ (TJ) |
Summary of Features:
● Dual N-Channel
● Enhancement mode
● Logic Level
● 150 °C operating temperature
● Avalanche rated
● dv/dt rated
● Green Product(RoHS compliant)
● AEC Qualified.
●Benefits:
● Dual DS0-8 can replace multiple DPAKs for significant PCB area savings and system level cost reduction.
● Bond wire is 200um for up to 20A current
● Larger source lead frame connection for wire bonding
● Package: PG-DSO-8
● Same thermal and electrical performance as a DPAK with the same die size.
● Exposed pad provides excellent thermal transfer (varies by die size)
● Two N-Channel MOSFETs in one package with 2 isolated leadframes
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