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BYD37D
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BYD37D Datasheet PDF (8 Pages)
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BYD37D Specifications

BYD37D Size & Package

BYD37D Documents

NXP
8 Pages / 0.81 MByte
NXP
12 Pages / 0.06 MByte

BYD37 Documents

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Cavity free cylindrical glass package through Implotec technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
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DIODE 0.6A, 1000V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode
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