The X series surface mount Multilayer Ceramic Chip Capacitor in X7R dielectric address the primary failure mode of MLCCs - flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Featuring several of the highest CV (capacitance/voltage) values available in the industry, these devices utilize a pliable and conductive silver epoxy between the base metal and nickel barrier layers of the termination system. The addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short-circuit failures. Although flexible termination technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems.
● Industry-leading CV values
● Superior flex performance (up to 5mm)
● Exceptional performance at high frequencies
● Low ESR and ESL
● Non-polar device, minimizing installation concerns
● 100% Pure matte tin-plated termination finish allowing for excellent solderability
● SnPb plated termination finish option available (5% Pb minimum)
● EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220 and 2225 case sizes available
● DC voltage ratings of 500, 630V, 1, 1.5, 2, 2.5 and 3kV
● Capacitance offerings ranging from 10pF to 560nF
● Available capacitance tolerances of ±5%, ±10% or ±20%
