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CAY16-3301F4
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CAY16-3301F4 Datasheet PDF - Bourns J.W. Miller

Manufacturer:Bourns J.W. Miller
Case Package:1206
Description:Res Thick Film Array 3.3KΩ 1% ±200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Convex SMD Paper T/R
Documentation:CAY16-3301F4 Datasheet (5 Pages)Part Numbering System on1 Page
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CAY16-3301F4 Datasheet PDF (5 Pages)
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CAY16-3301F4 Specifications

TYPEDESCRIPTION
Mounting StyleSurface Mount
Number of Pins8 Pin
Case/Package (SI)3216
Case/Package1206
Resistance3.3 KΩ
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CAY16-3301F4 Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusObsolete
PackagingTape & Reel (TR)
Size-Length3.2 mm
Size-Width1.6 mm
Size-Height0.5 mm
Operating Temperature55℃ ~ 125℃
Temperature Coefficient±250 ppm/℃
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CAY16-3301F4 Documents

CAY16-3301F4 Datasheet
Bourns J.W. Miller
5 Pages / 0.5 MByte

CAY163301 Documents

CAY16-3301F4LF Datasheet PDF
Bourns J.W. Miller
Res Thick Film Array 3.3KΩ 1% 0.25W(1/4W) ±200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Convex SMD T/R
CAY16-3301F4 Datasheet PDF
Bourns J.W. Miller
Res Thick Film Array 3.3KΩ 1% ±200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Convex SMD Paper T/R
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