| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 8 Pin |
| Case/Package | PowerTDFN-8 |
| Number of Channels | 1 Channel |
| Number of Positions | 8 Position |
| Drain to Source Resistance (on) (Rds) | 0.0022 Ω |
| Polarity | N-Channel |
| Power Dissipation | 3.1 W |
| Threshold Voltage | 1.6 V |
| Drain to Source Voltage (Vds) | 25 V |
| Breakdown Voltage (Drain to Source) | 25 V |
| Continuous Drain Current (Ids) | 100 A |
| Rise Time | 18.3 ns |
| Input Capacitance (Ciss) | 2660pF @12.5V(Vds) |
| Input Power (Max) | 3.1 W |
| Fall Time | 9.2 ns |
| Operating Temperature (Max) | 150 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Power Dissipation (Max) | 3.1W (Ta) |
| TYPE | DESCRIPTION |
|---|
| Packaging | Tape & Reel (TR) |
| Size-Length | 5.8 mm |
| Size-Width | 4.9 mm |
| Size-Height | 1.1 mm |
| Operating Temperature | -55℃ ~ 150℃ (TJ) |
The NexFET™ power MOSFET has been designed to minimize losses in power conversion applications.
● Ultra Low Qg and Qgd
● Low Thermal Resistance
● Avalanche Rated
● Pb Free Terminal Plating
● RoHS Compliant
● Halogen Free
● SON 5mm × 6mm Plastic Package
● APPLICATIONS
● Point-of-Load Synchronous Buck Converter for Applications in
●Networking, Telecom and Computing Systems
● Optimized for Control FET Applications
●NexFET is a trademark of Texas Instruments.
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