Part Datasheet Search > Memory Chip > Microchip > AT93C46E-TH-B Datasheet PDF > AT93C46E-TH-B Datasheet Pages 13/17
AT93C46E-TH-B Datasheet - Microchip
| Manufacturer: | Microchip |
| Category: | Memory Chip |
| Case Package: | TSSOP-8 |
| Description: | EEPROM Serial-3Wire 1Kbit 64 x 16 2.5V/3.3V/5V 8Pin TSSOP Tube |
| Pictures: |
AT93C46E-TH-BDatasheet PDF
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13
5207D–SEEPR–1/08
AT93C46E
5. Packaging Information
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
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