Part Datasheet Search > Memory Chip > Microchip > AT93C46E-TH-B Datasheet PDF > AT93C46E-TH-B Datasheet Pages 15/17
AT93C46E-TH-B Datasheet - Microchip
| Manufacturer: | Microchip |
| Category: | Memory Chip |
| Case Package: | TSSOP-8 |
| Description: | EEPROM Serial-3Wire 1Kbit 64 x 16 2.5V/3.3V/5V 8Pin TSSOP Tube |
| Pictures: |
AT93C46E-TH-BDatasheet PDF
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15
5207D–SEEPR–1/08
AT93C46E
8A2 - TSSOP
TITLE
DRAWING NO.GPC
REV.
Package Drawing Contact:
packagedrawings@atmel.com
8A2TNR C
8A2, 8-lead, 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
10/29/08
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A – – 1.20
A2 0.80 1.00 1.05
b 0.19 – 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 RE3
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions
shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at D
atum Plane H.
Side View
End View
Top View
A2
A
L
L1
D
123
E1
N
b
Pin 1 indicator
this corner
E
e
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