Part Datasheet Search > ST Microelectronics > LIS2DW12 Datasheet PDF > LIS2DW12 Datasheet Pages 61/63
LIS2DW12 Datasheet - ST Microelectronics
Manufacturer: | ST Microelectronics |
Description: | MEMS digital output motion sensor:high-performance ultra-low-power 3-axis "femto" accelerometer |
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LIS2DW12Datasheet PDF
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DocID029682 Rev 4 61/63
LIS2DW12 Package information
63
9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
9.1 Soldering information
The LGA package is compliant with the ECOPACK
®
, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
9.2 LGA-12 package information
Figure 18. LGA-12 2.0 x 2.0 x 0.7 mm package outline and mechanical data
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