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PIC16F716T-E/SS Datasheet - Microchip
| Manufacturer: | Microchip |
| Category: | Microcontrollers |
| Case Package: | SSOP-20 |
| Description: | MCU 8Bit PIC16 PIC RISC 28KB Flash 2.5V/3.3V/5V 20Pin SSOP T/R |
| Pictures: |
PIC16F716T-E/SSDatasheet PDF
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PIC16F716
DS41206B-page 122 © 2007 Microchip Technology Inc.
14.2 Package Details
The following sections give the technical details of the packages.
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 18
Pitch e .100 BSC
Top to Seating Plane A – – .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 – –
Shoulder to Shoulder Width E .300 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .880 .900 .920
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .014
Upper Lead Width b1 .045 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB – – .430
NOTE 1
N
E1
D
1
2 3
A
A1
A2
L
E
eB
c
e
b1
b
Microchip Technology Drawing C04-007
B
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