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XMC4400
XMC4000 Family
Package and Reliability
Data Sheet 97 V1.2, 2015-12
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance R
ΘJA
” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (P
INT
+ P
IOSTAT
+ P
IODYN
) × R
ΘJA
The internal power consumption is defined as
P
INT
= V
DDP
× I
DDP
(switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
P
IOSTAT
= Σ((V
DDP
-V
OH
) × I
OH
) + Σ(V
OL
× I
OL
)
The dynamic external power consumption caused by the output drivers (
P
IODYN
) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
• Reduce
V
DDP
, if possible in the system
• Reduce the system frequency
• Reduce the number of output pins
• Reduce the load on active output drivers
4.2 Package Outlines
The availability of different packages for different devices types is listed in Table 1,
specific packages for different device markings are listed in Table 2.
The exposed die pad dimensions are listed in Table 60.
Table 61 Differences PG-LQFP-100-11 to PG-LQFP-100-24
Change PG-LQFP-100-11 PG-LQFP-100-25
Thermal Resistance
Junction Ambient (
R
ΘJA
)
20.5 K/W 20.0 K/W
Lead Width 0.22
±0.05
mm 0.2
+0.07
-0.03
mm
Lead Thickness 0.15
+0.05
-0.06
mm 0.127
+0.073
-0.037
mm
Exposed Die Pad outer
dimensions
7.0 mm × 7.0 mm 7.0 mm × 7.0 mm
Exposed Die Pad U-
Groove inner dimensions
n.a. 6.2 mm × 6.2 mm
Subject to Agreement on the Use of Product Information
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