| TYPE | DESCRIPTION |
|---|
| Case/Package | AG-EASY1B-2 |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
Summary of Features:
● High Speed IGBT H3
● Low Switching Losses
● Fast Silicon diode 1200V
● Al(2)O(3) Substrate with Low Thermal Resistance
● Integrated NTC temperature sensor
● PressFIT Contact Technology
●Benefits:
● Compact module concept
● Optimized customer’s development cycle time and cost
● Configuration flexibility
Infineon
11 Pages / 0.72 MByte
Infineon
36 Pages / 3.45 MByte
Infineon
73 Pages / 2.93 MByte
Infineon
33 Pages / 2.24 MByte
Infineon
Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Infineon
Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Infineon
Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Infineon
Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Infineon
Mod Diode Bridge Easy1b-2-1
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