TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 6 Pin |
Voltage Rating (DC) | -20.0 V |
Current Rating | -600 mA |
Case/Package | SC-70-6 |
Number of Positions | 6 Position |
Drain to Source Resistance (on) (Rds) | 0.3 Ω |
Polarity | P-Channel |
Power Dissipation | 300 mW |
Input Capacitance | 114 pF |
Gate Charge | 1.40 nC |
Drain to Source Voltage (Vds) | 20 V |
Breakdown Voltage (Gate to Source) | ±12.0 V |
Continuous Drain Current (Ids) | 600 mA |
Rise Time | 14 ns |
Input Capacitance (Ciss) | 114pF @10V(Vds) |
Input Power (Max) | 300 mW |
Fall Time | 1.7 ns |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -55 ℃ |
Power Dissipation (Max) | 0.3 W |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Size-Length | 2 mm |
Size-Width | 1.25 mm |
Size-Height | 1 mm |
Operating Temperature | -55℃ ~ 150℃ (TJ) |
The FDG6306P is a dual P-channel MOSFET rugged gate version advanced PowerTrench® process. It has been optimized for power management applications with a wide range of gate drive voltage (2.5 to 12V). It is suitable for use with battery management and load switch applications.
● Low gate charge
● High performance Trench technology for extremely low RDS (ON)
● Compact industry standard surface-mount-package
● ±12V Gate to source voltage
● -0.6A Continuous drain current
● -2A Pulsed drain current
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