TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 6 Pin |
Current Rating | 220 mA |
Case/Package | SC-70-6 |
Number of Positions | 6 Position |
Drain to Source Resistance (on) (Rds) | 2.6 Ω |
Polarity | N-Channel, P-Channel, Dual N-Channel, Dual P-Channel |
Power Dissipation | 300 mW |
Threshold Voltage | 850 mV |
Input Capacitance | 114 pF |
Gate Charge | 1.40 nC |
Drain to Source Voltage (Vds) | 25 V |
Breakdown Voltage (Drain to Source) | ±25.0 V |
Breakdown Voltage (Gate to Source) | ±8.00 V |
Continuous Drain Current (Ids) | 220 mA |
Rise Time | 8.00 ns |
Input Capacitance (Ciss) | 9.5pF @10V(Vds) |
Input Power (Max) | 300 mW |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -55 ℃ |
Power Dissipation (Max) | 0.3 W |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Size-Length | 2 mm |
Size-Width | 1.25 mm |
Size-Height | 1 mm |
Operating Temperature | -55℃ ~ 150℃ (TJ) |
The FDG6322C is a dual N/P-channel logic level enhancement-mode MOSFET with high cell density and DMOS technology. This very high density process is especially tailored to minimize ON-state resistance. This device has been designed especially for low voltage applications as a replacement for bipolar digital transistors and small signal MOSFETs. Since bias resistors are not required, this dual digital FET can replace several different digital transistors, with different bias resistor values.
● Very small package outline
● Very low level gate drive requirements allowing direct operation in 3V circuits (VGS (th) <1.5V)
● Gate-source Zener for ESD ruggedness
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