TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 8 Pin |
Voltage Rating (DC) | 20.0 V |
Current Rating | 9.40 A |
Case/Package | SOIC-8 |
Number of Positions | 8 Position |
Drain to Source Resistance (on) (Rds) | 0.01 Ω |
Polarity | N-Channel, Dual N-Channel |
Power Dissipation | 2 W |
Threshold Voltage | 1 V |
Input Capacitance | 1.82 nF |
Gate Charge | 16.0 nC |
Drain to Source Voltage (Vds) | 20 V |
Breakdown Voltage (Drain to Source) | 20.0 V |
Breakdown Voltage (Gate to Source) | ±12.0 V |
Continuous Drain Current (Ids) | 9.40 A |
Rise Time | 15 ns |
Input Capacitance (Ciss) | 1821pF @10V(Vds) |
Input Power (Max) | 900 mW |
Fall Time | 16 ns |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -55 ℃ |
Power Dissipation (Max) | 2 W |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Size-Length | 5 mm |
Size-Width | 4 mm |
Size-Height | 1.5 mm |
Operating Temperature | -55℃ ~ 150℃ |
The FDS6898A is a dual N-channel logic level PWM optimized MOSFET produced using advanced PowerTrench® process. It has been especially tailored to minimize the ON-state resistance and yet maintain superior switching performance. This device is well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required.
● Low gate charge
● High performance Trench technology for extremely low RDS (ON)
● High power and current handling capability
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