Description:
●The new CoolMOS™ ThinPAK 5x6 is a leadless SMD package especially designed for high voltage MOSFETs. This new package has a very small footprint of 5x6mm 2 and a very low profile with only 1mm height.
●This significantly smaller package size in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power- density driven designs. The ThinPAK 5x6 package is characterized by a very low source inductance 1.6nH, as well as a similar thermal performance as DPAK.
●The package hence enables faster and thus more efficient switching of power MOSFETs and is easier to handle in terms of switching behavior and EMI.
●Summary of Features:
● Small footprint (5x6mm²)
● Low profile (1mm)
● Low parasitic inductance
● RoHS compliant
● Halogen free mold compound
●Benefits:
● Reduced board space consumption
● Increased power density
● Short commutation loop
● Easy to use products
● Environmentally friendly
●Target Applications:
● Adapter
● Consumer
● Lighting
