TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 3 Pin |
Case/Package | TO-263-3 |
Number of Positions | 3 Position |
Drain to Source Resistance (on) (Rds) | 0.5 Ω |
Polarity | P-Channel |
Power Dissipation | 3 W |
Threshold Voltage | 4 V |
Drain to Source Voltage (Vds) | 200 V |
Continuous Drain Current (Ids) | -11.0 A |
Rise Time | 43 ns |
Input Capacitance (Ciss) | 1200pF @25V(Vds) |
Input Power (Max) | 3 W |
Fall Time | 38 ns |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -55 ℃ |
Power Dissipation (Max) | 125 W |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Size-Length | 10.67 mm |
Size-Width | 9.65 mm |
Size-Height | 4.83 mm |
Operating Temperature | -55℃ ~ 150℃ (TJ) |
Minimum Packing Quantity | 800 |
The IRF9640STRLPBF is a third generation P-channel enhancement-mode Power MOSFET comes with the best combination of fast switching, ruggedized device design and low ON-resistance. The D2PAK is a surface-mount power package capable of accommodating die size up to HEX-4. It provides the highest power capability in any existing surface-mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2W in a typical surface-mount application.
● Dynamic dV/dt rating
● Repetitive avalanche rated
● Ease of paralleling
● Surface-mount
● Halogen-free
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