TYPE | DESCRIPTION |
---|
Mounting Style | Through Hole |
Number of Pins | 3 Pin |
Voltage Rating (DC) | -100 V |
Current Rating | -7.70 A |
Case/Package | TO-220-3 |
Number of Positions | 3 Position |
Drain to Source Resistance (on) (Rds) | 0.3 Ω |
Polarity | P-Channel |
Power Dissipation | 38 W |
Drain to Source Voltage (Vds) | 100 V |
Breakdown Voltage (Drain to Source) | -100 V |
Continuous Drain Current (Ids) | -7.70 A |
Rise Time | 52.0 ns |
Isolation Voltage | 2.50 kV |
Input Capacitance (Ciss) | 860pF @25V(Vds) |
Operating Temperature (Max) | 175 ℃ |
Operating Temperature (Min) | -55 ℃ |
Power Dissipation (Max) | 42 W |
TYPE | DESCRIPTION |
---|
Packaging | Tube |
Size-Length | 10.63 mm |
Size-Width | 4.7 mm |
Size-Height | 16.12 mm |
Operating Temperature | -55℃ ~ 175℃ |
The IRFI9530GPBF is a third generation P-channel enhancement-mode Power MOSFET comes with the best combination of fast switching, ruggedized device design and low ON-resistance. The FULLPAK eliminates the need for additional insulating hardware. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heat sink. The isolation is equivalent to using a 100 micron mica barrier with standard product. The FULLPAK is mounted to a heat sink using a single clip or by a single screw fixing.
● Isolated package
● 2.5kVRMS (t = 60s, f = 60Hz) High voltage isolation
● 4.8mm Sink to lead creepage distance
● -55 to 175°C Operating temperature range
● Dynamic dV/dt rating
● Low thermal resistance
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