TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 86 Pin |
Case/Package | TSOP-86 |
Supply Current | 100 mA |
Number of Positions | 86 Position |
Number of Bits | 32 Bit |
Access Time | 5.4 ns |
Access Time(Max) | 5.4ns, 6.5ns |
Operating Temperature (Max) | 85 ℃ |
Operating Temperature (Min) | -40 ℃ |
Supply Voltage | 3V ~ 3.6V |
Supply Voltage (Max) | 3.6 V |
Supply Voltage (Min) | 3 V |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Operating Temperature | -40℃ ~ 85℃ (TA) |
SDRAM Memory IC 128Mb (4M x 32) Parallel 143MHz 5.4ns 86-TSOP II
Integrated Silicon Solution(ISSI)
60 Pages / 0.83 MByte
Integrated Silicon Solution(ISSI)
61 Pages / 0.89 MByte
Integrated Silicon Solution(ISSI)
128M, 3.3V, SDRAM, 4Mx32, 143MHz, 86Pin TSOP II (400 mil) RoHS
Integrated Silicon Solution(ISSI)
DRAM Chip SDRAM 128Mbit 4Mx32 3.3V 86Pin TSOP-II
Integrated Silicon Solution(ISSI)
128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS, IT
Integrated Silicon Solution(ISSI)
128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS
Integrated Silicon Solution(ISSI)
128M, 3.3V, SDRAM, 4Mx32, 143MHz, 86Pin TSOP II (400 mil) RoHS, IT, T&R
Integrated Silicon Solution(ISSI)
128M, 3.3V, SDRAM, 4Mx32, 143MHz, 86Pin TSOP II (400 mil) RoHS, T&R
Integrated Silicon Solution(ISSI)
128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS, T&R
Integrated Silicon Solution(ISSI)
128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R
Integrated Silicon Solution(ISSI)
Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, 8 X 13MM, 0.8MM PITCH, MO-207, TWBGA-90
Integrated Silicon Solution(ISSI)
DRAM 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm)
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