| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 44 Pin |
| Case/Package | TSOP-44 |
| Number of Positions | 44 Position |
| Number of Bits | 8 Bit |
| Access Time | 10 ns |
| Access Time(Max) | 10 ns |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Supply Voltage | 2.4V ~ 3.6V |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tray |
| Size-Length | 18.54 mm |
| Size-Width | 10.29 mm |
| Size-Height | 1.05 mm |
| Operating Temperature | -40℃ ~ 85℃ (TA) |
SRAM - Asynchronous Memory IC 4Mb (512K x 8) Parallel 10ns 44-TSOP II
Integrated Silicon Solution(ISSI)
25 Pages / 0.53 MByte
Integrated Silicon Solution(ISSI)
2 Pages / 0.04 MByte
Integrated Silicon Solution(ISSI)
26 Pages / 0.53 MByte
Integrated Silicon Solution(ISSI)
4Mb, High-Speed/Low Power, Async, 512K x 8, 8ns/3.3V, or 10ns, 2.4V-3.6V, 44Pin TSOP II, RoHS
Integrated Silicon Solution(ISSI)
4Mb, High-Speed/Low Power, Async, 512K x 8, 8ns/3.3V, or 10ns/2.4V-3.6V, 36 Ball mBGA (8x10 mm), RoHS
Integrated Silicon Solution(ISSI)
4Mb,High-Speed/Low Power,Async,512K X 8,8ns/3.3V,or 10ns,2.4V-3.6V,36Pin SOJ (400mil), Leadfree
Integrated Silicon Solution(ISSI)
4Mb,High-Speed/Low Power,Async,512K X 8,8ns/3.3V,or 10ns,2.4V-3.6V,44Pin TSOP II, Leadfree
Integrated Silicon Solution(ISSI)
Standard SRAM, 512KX8, 10ns, CMOS, PDSO44, LEAD FREE, PLASTIC, TSOP2-44
Integrated Silicon Solution(ISSI)
4Mb,High-Speed/Low Power,Async,512K X 8,8ns/3.3V,or 10ns,2.4V-3.6V,36 Ball MBGA (8x10 Mm)
Integrated Silicon Solution(ISSI)
4Mb,High-Speed/Low Power,Async,512K X 8,8ns/3.3V,or 10ns,2.4V-3.6V,36Pin SOJ (400mil), Leadfree
Integrated Silicon Solution(ISSI)
4Mb,High-Speed/Low Power,Async,512K X 8,8ns/3.3V,or 10ns,2.4V-3.6V,36 Ball MBGA (8x10 Mm), Leadfree
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 2.5V/3.3V 4M-Bit 512K x 8 10ns 36Pin TFBGA T/R
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