TYPE | DESCRIPTION |
---|
Mounting Style | Through Hole |
Number of Pins | 3 Pin |
Voltage Rating (DC) | 600 V |
Current Rating | 24.0 A |
Case/Package | TO-247-3 |
Rise Time | 210 ns |
Breakdown Voltage (Collector to Emitter) | 600 V |
Input Power (Max) | 250 W |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -55 ℃ |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Obsolete |
Packaging | Bulk |
Size-Length | 16.26 mm |
Size-Width | 5.3 mm |
Size-Height | 21.46 mm |
Operating Temperature | -55℃ ~ 150℃ (TJ) |
Surface Mountable
●Features
●International standard packages JEDEC TO-247 SMD surface mountable and JEDEC TO-247 AD
●High frequency IGBT
●High current handling capability
●2nd generation HDMOS™ process
●MOS Gate turn-on
●\- drive simplicity
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Trans IGBT Chip N-CH 600V 75A 250000mW 3Pin(3+Tab) TO-247AD
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Trans IGBT Chip N-CH 600V 75A 3Pin(3+Tab) TO-247
IXYS Semiconductor
Trans IGBT Chip N-CH 600V 75A 250000mW
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