| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 2 Pin |
| Current Rating | 500 mA |
| Case/Package (SI) | 1608 |
| Case/Package | 0603 |
| Inductance | 3.3 nH |
| Self Resonant Frequency | 6 GHz |
| Q-Factor | 12.0 |
| Part Family | LQG |
| Resistance | 150 mΩ |
| Resonant Frequency | 6.00 GHz |
| Shielding | No |
| Inductance Tolerance | ±0.3 nH |
| Test Frequency | 100 MHz |
| DC Resistance (DCR) | ≤150 mΩ |
| Current Rating (DC) | 500 mA |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Resistance (DC Max) | 0.15 Ω |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Cut Tape (CT) |
| Size-Length | 1.6 mm |
| Size-Width | 0.8 mm |
| Size-Height | 0.8 mm |
| Operating Temperature | -40℃ ~ 85℃ |
| Minimum Packing Quantity | 4000 |
LQG18H Series The LQG18H series is designed to realize stable characteristics in high frequency range applying integrated multilayer process. n Features 1. High-Q, stable inductance in high frequency is achieved by the original structure that minimizes stray capacitance. It is suitable for the high frequency circuits of mobile communication equipment. 2. Small size of LQG18H (1.6x0.8x0.8mm) is suitable for small, handy equipment, especially for card size equipment. 3. The external electrodes with nickel barrier structure provide excellent solder heat resistance. n Applications 1. High frequency circuits of mobile phones such as PA, ANT, VCO, SAW, etc. 2. Mobile phones such as GSM, CDMA, PDC, etc. 3. "Bluetooth" 4. W-LAN 5. High frequency circuits in general
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