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OMAP5910 Datasheet PDF - TI
Manufacturer: | TI |
Description: | DUAL-CORE PROCESSOR |
Documentation: | OMAP5910 User Reference Manual Guide (171 Pages) |
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OMAP5910 Datasheet PDF
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OMAP5910 Datasheet PDF (171 Pages)
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OMAP5910 Function Overview
The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.
●The OMAP platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.
●The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.
●The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS software kernel foundation, and is available in a 289-ball MicroStar BGA package.
●The OMAP5910 is targeted at the following applications:
● Applications processing devices
● Mobile communications
● 802.11
● Bluetooth wireless technology
● GSM (including GPRS and EDGE)
● CDMA
● Proprietary government and other
● Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.)
● Advanced speech applications (text-to-speech, speech recognition)
● Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs)
● Graphics and video acceleration
● Generalized web access
● Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)
● Low-Power, High-Performance CMOS Technology
● 0.13-µm Technology
● 1.6-V Core Voltage
● TI925T (MPU) ARM9TDMI Core
● Support 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
● 16K-Byte Instruction Cache
● 8K-Byte Data Cache
● Data and Program Memory Management Units (MMUs)
● Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs
● 17-Word Write Buffer
● TMS320C55x (C55x) DSP Core
● One/Two Instructions Executed per Cycle
● Dual Multipliers (Two Multiply-Accumulates per Cycle)
● Two Arithmetic/Logic Units
● One Internal Program Bus
● Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses)
● 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
● 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes)
● 16K x 16-Bit On-Chip ROM (32K Bytes)
● Instruction Cache (24K Bytes)
● Video Hardware Accelerators for DCT, IDCT, Pixel Interpolation, and Motion Estimation for Video Compression
● 192K Bytes of Shared Internal SRAM
● Memory Traffic Controller (TC)
● 16-Bit EMIFS External Memory Interface to Access up to 128M Bytes of Flash, ROM, or ASRAM
● 16-Bit EMIFF External Memory Interface to Access up to 64M Bytes of SDRAM
● 9-Channel System DMA Controller
● DSP Memory Management Unit
● Endianism Conversion Logic
● Digital Phase-Locked Loop (DPLL) for MPU/DSP/TC Clocking Control
● DSP Peripherals
● Three 32-Bit Timers and Watchdog Timer
● Level1/Level2 Interrupt Handlers
● Six-Channel DMA Controller
● Two Multichannel Buffered Serial Ports
● Two Multichannel Serial Interfaces
● TI925T Peripherals
● Three 32-Bit Timers and Watchdog Timer
● 32-kHz Timer
● Level1/Level2 Interrupt Handlers
● USB (Full/Low Speed) Host Interface With up to 3 Ports
● USB (Full Speed) Function Interface
● One Integrated USB Transceiver for Either Host or Function
● Multichannel Buffered Serial Port
● Inter-Integrated Circuit (I2C) Master and Slave Interface
● Microwire Serial Interface
● Multimedia Card (MMC) and Secure Digital (SD) Interface
● HDQ/1-Wire® Interface
● Camera Interface for CMOS Sensors
● ETM9 Trace Module for TI925T Debug
● Keyboard Matrix Interface (6 x 5 or 8 x 8)
● Up to Ten MPU General-Purpose I/Os
● Pulse-Width Tone (PWT) Interface
● Pulse-Width Light (PWL) Interface
● Two LED Pulse Generators (LPGs)
● Real-Time Clock (RTC)
● LCD Controller With Dedicated System DMA Channel
● Shared Peripherals
● Three Universal Asynchronous Receiver/Transmitters (UARTs) (One Supporting SIR Mode for IrDA)
● Four Interprocessor Mailboxes
● Up to 14 Shared General-Purpose I/Os
● Individual Power-Saving Modes for MPU/DSP/TC
● On-Chip Scan-Based Emulation Logic
● IEEE Std 1149.1 (JTAG) Boundary Scan Logic
● Two 289-Ball MicroStar BGA (Ball Grid Array) Package Options (GZG and GDY Suffixes)
●TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments.
●ARM9TDMI is a trademark of ARM Limited.
●Thumb is a registered trademark of ARM Limited.
●Microwire is a trademark of National Semiconductor Corporation.
●1-Wire is a registered trademark of Dallas Semiconductor Corporation.
●IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture.
●OMAP and DSP/BIOS are trademarks of Texas Instruments.
●Bluetooth is a trademark owned by Bluetooth SIG, Inc.
●Windows is a registered trademark of Microsoft Corporation.
●Other trademarks are the property of their respective owners.
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