| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 20 Pin |
| Case/Package | LSSOP |
| RAM Memory Size | 384 B |
| Number of ADCs | 1 ADC |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Size-Length | 6.6 mm |
| Size-Width | 4.5 mm |
| Size-Height | 1.15 mm |
Overview
●These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/1B Group has on-chip data flash ROM (1 KB × 2 blocks). The difference between the R8C/1A Group and R8C/1B Group is only the presence or absence of data flash ROM. Their peripheral functions are the same.
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The R8C/1A is based on the R8C CPU Core. Maximum operating frequency is 20MHz. A Flash Memory Version is available. ...
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