| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 48 Pin |
| Case/Package | LQFP-48 |
| Clock Speed | 20.0 MHz |
| RAM Memory Size | 2K x 8 |
| Access Time | 20.0 µs |
| Core Architecture | R8C |
| Number of ADCs | 1 ADC |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Power Dissipation (Max) | 300 mW |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tray |
| Operating Temperature | -40℃ ~ 85℃ (TA) |
Overview
●This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged
●in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of
●instruction efficiency. With 1 Mbyte ofaddress space, it is capable of executing instructions athigh speed. This
●Furthermore, the data flash (1 KB x2 blocks) is embedded in the R8C/21 Group.
●Applications
●Automotive, etc.
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The R8C/21 is based on the R8C CPU Core. Maximum operating frequency is 20MHz. A Flash Memory Version is available. ...
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