| TYPE | DESCRIPTION |
|---|
| Number of Pins | 20 Pin |
| Case/Package | LSSOP |
| RAM Memory Size | 1 KB |
| Power Dissipation | 500 mW |
| Power Dissipation (Max) | 500 mW |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Operating Temperature | -20℃ ~ 85℃ |
Overview
●These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip data flash (1 KB × 2 blocks).
●Applications
●Electronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.
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