The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.
●Throughout this document, the device is abbreviated as F28335.
● High-Performance Static CMOS Technology
● Up to 150 MHz for TC = 55°C to 125°C
●and Up to 100 MHZ for TC = 210°C
● 1.9-V Core, 3.3-V I/O Design
● High-Performance 32-Bit CPU
● IEEE-754 Single-Precision Floating-Point Unit (FPU))
● 16 × 16 and 32 × 32 MAC Operations
● 16 × 16 Dual MAC
● Harvard Bus Architecture
● Fast Interrupt Response and Processing
● Unified Memory Programming Model
● Code-Efficient (in C/C++ and Assembly)
● Six Channel DMA Controller (for ADC, McBSP,
●ePWM, XINTF, and SARAM)
● 16-bit or 32-bit External Interface (XINTF)
● Over 2M × 16 Address Reach
● On-Chip Memory
● 256K × 16 Flash, 34K × 16 SARAM
● 1K × 16 OTP ROM
● Boot ROM (8K x 16)
● With Software Boot Modes (via SCI, SPI, CAN,
●I2C, McBSP, XINTF, and Parallel I/O)
● Standard Math Tables
● Clock and System Control
● Dynamic PLL Ratio Changes Supported
● On-Chip Oscillator
● Watchdog Timer Module
● GPIO0 to GPIO63 Pins Can Be Connected to One
●of the Eight External Core Interrupts
● Peripheral Interrupt Expansion (PIE) Block
●That Supports All 58 Peripheral Interrupts
● 128-Bit Security Key/Lock
● Protects Flash/OTP/RAM Blocks
● Prevents Firmware Reverse Engineering
● Enhanced Control Peripherals
● Up to 18 PWM Outputs
● Up to 6 HRPWM Outputs With 150 ps MEP Resolution
● Up to 6 Event Capture Inputs
● Up to 2 Quadrature Encoder Interfaces
● Up to 8 32-bit/Nine 16-bit Timers
● Three 32-Bit CPU Timers
● Serial Port Peripherals
● Up to 2 CAN Modules
● Up to 3 SCI (UART) Modules
● Up to 2 McBSP Modules (Configurable as SPI)
● One SPI Module
● One Inter-Integrated-Circuit (I2C) Bus
● 12-Bit ADC, 16 Channels
● 80-ns Conversion Rate
● 2 × 8 Channel Input Multiplexer
● Two Sample-and-Hold
● Single/Simultaneous Conversions
● Internal or External Reference
● Up to 88 Individually Programmable, Multiplexed
●GPIO Pins With Input Filtering
● JTAG Boundary Scan Support IEEE Standard 1149.1-1990
●Standard Test Access Port and Boundary Scan Architecture
● Advanced Emulation Features
● Analysis and Breakpoint Functions
● Real-Time Debug via Hardware
● Development Support Includes
● ANSI C/C++ Compiler/Assembler/Linker
● Code Composer Studio IDE
● DSP/BIOS
● Digital Motor Control and Digital Power
●Software Libraries
● Low-Power Modes and Power Savings
● IDLE, STANDBY, HALT Modes Supported
● Disable Individual Peripheral Clocks
● Package Option
● Ceramic Pin Grid Array (GB)
● HLQFP (PTP)
● Temperature Range:
● GB Package: –55°C to 210°C (GB)
● PTP Package: –55°C to 150°C (PTP)
● APPLICATIONS
● Controlled Baseline
● One Assembly/Test Site
● One Fabrication Site
● Available in Extreme (–55°C/210°C)
●Temperature Range(1)
● Extended Product Life Cycle
● Extended Product-Change Notification
● Product Traceability
● Texas Instruments high temperature products utilize
●highly optimized silicon (die) solutions with design
●and process enhancements to maximize performance over
●extended temperatures.
●(1) Custom temperature ranges available
