SMUN5211T3 Datasheet PDF - ON Semiconductor

Features • Simplifies Circuit Design • Reduces Board Space • Reduces Component Count • The SC−70/SOT−323 package can be soldered using wave or reflow. The modified gull−winged leads absorb thermal stress during soldering eliminating the possibility of damage to the die. • Available in 8 mm embossed tape and reel. Use the Device Number to order the 7 inch/3000 unit reel. • Pb−Free Packages are Available