In order to minimize the parasitic capacitance in high-speed measurements (O-scope probe capacitance), the SN65LVDS122 EVM provides a split power plane (layer 3). The split power plane allows the user to offset the device so that the common mode output is compatible with the 50 ohms to ground termination within the O-scope. Terminating the EVM within the O-scope eliminates any bandwidth limitations introduced by an O-scope probe.
●In addition to the split power plane, the EVM also provides jumpers W3 (S0), W4 (S1), and J9 (1DE/2DE) to control the functionality of the SN65LVDS122 cross-point switch. Refer to the datasheet for the control logic tables.
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the sn65lvds122 and sn65lvdt122 are crosspoint switches that use low voltage differential signaling (lvds) to achieve...
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Crosspoint-Switch (>1Gbps) 2X2 1.5Gbps LVDS Crosspoint Switch Digital Crosspoint Single 2x2 1.5Gbps 16Pin TSSOP Tube
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Crosspoint-Switch (>1Gbps) 2X2 1.5Gbps LVDS Crosspoint Switch Digital Crosspoint Single 2x2 1.5Gbps 16Pin SOIC Tube
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Crosspoint-Switch (>1Gbps) 2X2 1.5Gbps LVDS Crosspoint Switch Digital Crosspoint Single 2x2 1.5Gbps 16Pin TSSOP T/R
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Crosspoint-Switch (>1Gbps) 2X2 1.5Gbps LVDS Crosspoint Switch Digital Crosspoint Single 2x2 1.5Gbps 16Pin SOIC T/R
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2X2 1.5Gbps LVDS Crosspoint Switch 16-TSSOP -40℃ to 85℃
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Development & Evaluation Tools (Kits, Modules, and Boards) SN65LVDS122 Eval Module
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2X2 1.5Gbps LVDS Crosspoint Switch 16-TSSOP -40℃ to 85℃
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2X2 1.5Gbps LVDS Crosspoint Switch 16-SOIC -40℃ to 85℃
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2X2 1.5Gbps LVDS Crosspoint Switch 16-SOIC -40℃ to 85℃
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