Overview
●Designed for body electronics, the NXP® MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.
● Offers high-performance while continuing to meet low-power requirements
● Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures
● Provides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support)
● Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash
● Backed by a third-party ecosystem of development tools and software
●MoreLess
●## Features
● Power Architecture e200z1 core with variable length encoding (VLE)
● Optional VLE-only 32/16-bit e200z0 secondary core
● 16-channel eDMA (enhanced direct memory access)
● Memory management unit (MMU) with 4-entry translation look-aside buffer (TLB)
● Multiple low-power modes
● JTAG and Nexus class 2+ debug support
● Up to 1.5 MB of flash with error correction coding (ECC)
● The flash module features read while write (RWW) and small partitions for optimal bootloader and EEPROM emulation support
● Up to 80 KB of SRAM with ECC
● Memory protection unit (MPU) with up to 16 regions and 32B granularity
● This product is included in NXP®.s product longevity program, with assured supply for a minimum of 15 years after launch
●## Features
