| TYPE | DESCRIPTION |
|---|
| Number of Pins | 257 Pin |
| Case/Package | BGA-257 |
| RAM Memory Size | 384 KB |
| Power Dissipation | 1600 mW |
| Number of ADCs | 4 ADC |
| Operating Temperature (Max) | 125 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Power Dissipation (Max) | 1600 mW |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tray |
| Size-Height | 1.17 mm |
| Operating Temperature | -40℃ ~ 125℃ |
NXP
119 Pages / 1.67 MByte
NXP
32Bit MCU, Dual core Power Arch, 2.5Mb Flash, 384K RAM, Flexray, 200MHz, -40/+125℃, LQFP 144
NXP
32Bit MCU, Dual core Power Arch, 2.5Mb Flash, 384K RAM, Flexray, 180MHz, -40/+125℃, LQFP 144
Freescale
32Bit MCU POWER ARCH 2.5Mb FLAS
NXP
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MCU 32Bit MPC57xx e200z4 RISC 2560KB Flash 1.25V/3.3V 144Pin LQFP Tray
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2.5Mb NVM, 2 x e200Z4 cores, 200MHz, 384K SRAM, FlexRay, 4 x ADC, 2 x PWM, 2 x SENT
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2.5Mb NVM, 2 x e200Z4 cores, 180MHz, 384K SRAM, FlexRay, 4 x ADC, 2 x PWM, 2 x SENT
NXP
MCU 32Bit MPC57xx e200z4 RISC 2560KB Flash 1.25V/3.3V 257Pin MAPBGA Tray
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