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TMS320F28235ZJZS Datasheet PDF - TI
Manufacturer: | TI |
Category: | Microcontrollers |
Case Package: | BGA-176 |
Description: | MCU 32Bit C28x RISC 512KB Flash 1.9V/3.3V 176Pin BGA Tray |
Documentation: | TMS320F28235ZJZS Datasheet (2 Pages)TMS320F28235ZJZS User Reference Manual Guide (199 Pages) |
Pictures: |
TMS320F28235ZJZS Datasheet PDF
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TMS320F28235ZJZS Datasheet PDF (2 Pages)
TMS320F28235ZJZS Specifications
TYPE | DESCRIPTION |
---|---|
Mounting Style | Surface Mount |
Frequency | 150 MHz |
Number of Pins | 176 Pin |
Supply Voltage (DC) | 1.80V (min) |
Case/Package | BGA-176 |
Number of Positions | 176 Position |
Clock Speed | 150 MHz |
RAM Memory Size | 68 KB |
Number of Bits | 32 Bit |
FLASH Memory Size | 512 KB |
Number of UARTs | 3 UART |
Number of ADCs | 1 ADC |
Number of Inputs and Outputs | 88 Input |
Operating Temperature (Max) | 125 ℃ |
Operating Temperature (Min) | -40 ℃ |
Supply Voltage (Max) | 1.995 V |
Supply Voltage (Min) | 1.805 V |
TMS320F28235ZJZS Size & Package
TYPE | DESCRIPTION |
---|---|
Product Lifecycle Status | Active |
Packaging | Each |
Size-Length | 15 mm |
Size-Width | 15 mm |
Size-Height | 1.45 mm |
Operating Temperature | -40℃ ~ 125℃ |
TMS320F28235ZJZS Environmental
TMS320F28235ZJZS Function Overview
Description
●The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices, members of the TMS320C28x/ Delfino™ DSC/MCU generation, are highly integrated, high-performance solutions for demanding control applications.
●Features
●• High-Performance Static CMOS Technology
● – Up to 150 MHz (6.67-ns Cycle Time)
● – 1.9-V/1.8-V Core, 3.3-V I/O Design
●• High-Performance 32-Bit CPU (TMS320C28x)
● – IEEE 754 Single-Precision Floating-Point Unit (FPU) (F2833x Only)
● – 16 × 16 and 32 × 32 MAC Operations
● – 16 × 16 Dual MAC
● – Harvard Bus Architecture
● – Fast Interrupt Response and Processing
● – Unified Memory Programming Model
● – Code-Efficient (in C/C++ and Assembly)
●• Six-Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
●• 16-Bit or 32-Bit External Interface (XINTF)
● – More Than 2M × 16 Address Reach
●• On-Chip Memory
● – F28335, F28333, F28235: 256K × 16 Flash, 34K × 16 SARAM
● – F28334, F28234: 128K × 16 Flash, 34K × 16 SARAM
● – F28332, F28232: 64K × 16 Flash, 26K × 16 SARAM
●– 1K × 16 OTP ROM
●• Boot ROM (8K × 16)
● – With Software Boot Modes (Through SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
● – Standard Math Tables
●• Clock and System Control
● – On-Chip Oscillator
● – Watchdog Timer Module
●• GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
●• Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
●• 128-Bit Security Key/Lock
● – Protects Flash/OTP/RAM Blocks
● – Prevents Firmware Reverse Engineering
●• Enhanced Control Peripherals
● – Up to 18 PWM Outputs
● – Up to 6 HRPWM Outputs With 150 ps MEP Resolution
● – Up to 6 Event Capture Inputs
● – Up to 2 Quadrature Encoder Interfaces
● – Up to 8 32-Bit Timers (6 for eCAPs and 2 for eQEPs)
● – Up to 9 16-Bit Timers (6 for ePWMs and 3 XINTCTRs)
●• Three 32-Bit CPU Timers
●• Serial Port Peripherals
● – Up to 2 CAN Modules
● – Up to 3 SCI (UART) Modules
● – Up to 2 McBSP Modules (Configurable as SPI)
● – One SPI Module
● – One Inter-Integrated Circuit (I2C) Bus
●• 12-Bit ADC, 16 Channels
● – 80-ns Conversion Rate
● – 2 × 8 Channel Input Multiplexer
● – Two Sample-and-Hold
● – Single/Simultaneous Conversions
● – Internal or External Reference
●• Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
●• JTAG Boundary Scan Support
● – IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
●• Advanced Emulation Features
● – Analysis and Breakpoint Functions
● – Real-Time Debug Using Hardware
●• Development Support Includes
● – ANSI C/C++ Compiler/Assembler/Linker
● – Code Composer Studio™ IDE
● – DSP/BIOS™ and SYS/BIOS
● – Digital Motor Control and Digital Power Software Libraries
●• Low-Power Modes and Power Savings
● – IDLE, STANDBY, HALT Modes Supported
● – Disable Individual Peripheral Clocks
●• Endianness: Little Endian
●• Package Options:
● – Lead-free, Green Packaging
● – Plastic Ball Grid Array (BGA) (ZJZ)
● – MicroStar BGA™ (ZHH)
● – Low-Profile Quad Flatpack (LQFP) (PGF)
● – Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)
●• Temperature Options:
● – A: –40°C to 85°C (PGF, ZHH, ZJZ)
● – S: –40°C to 125°C (PTP, ZJZ)
● – Q: –40°C to 125°C (PTP, ZJZ)
● (AEC Q100 Qualification for Automotive Applications)
●Applications
●• Industrial AC Inverter Drives
●• Industrial Servo Amplifiers and Controllers
●• Computer Numerical Control (CNC) Machining
●• Uninterruptible and Server Power Supplies
●• Telecom Equipment Power
●• Solar Inverters
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