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XWL1835MODGAMOCT
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XWL1835MODGAMOCT Datasheet PDF - TI

Manufacturer:TI
Category:RF Modules & ICs
Case Package:FLGA-130
Description:WLAN+BTCombo Module Chip IEEE 802.11B/g/n Bluetooth v4.0(BLE) + EDR 100Pin SIP SMD Module
Documentation:XWL1835MODGAMOCT Datasheet (41 Pages)Pinout Diagram on7 Page8 Page9 PageHot
Package Outline Dimension on37 Page38 Page
Package Footprint Pad Layout on31 Page32 Page
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XWL1835MODGAMOCT Datasheet PDF (41 Pages)
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XWL1835MODGAMOCT Specifications

TYPEDESCRIPTION
Mounting StyleSurface Mount
Frequency2.4 GHz
Number of Pins130 Pin
Case/PackageFLGA-130
Output Power17.3 dBm
Supply Voltage2.9V ~ 4.8V
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XWL1835MODGAMOCT Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusActive
PackagingCut Tape (CT)
Operating Temperature-20℃ ~ 70℃
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XWL1835MODGAMOCT Documents

XWL1835MODGAMOCT Datasheet
TI
41 Pages / 1.26 MByte
XWL1835MODGAMOCT Other Datasheet PDF
TI
42 Pages / 1.23 MByte

XWL1835 Documents

XWL1835MODGAMOCT Datasheet PDF
TI
WLAN+BTCombo Module Chip IEEE 802.11B/g/n Bluetooth v4.0(BLE) + EDR 100Pin SIP SMD Module
XWL1835MODGAMOC Datasheet PDF
TI
Single-Band Combo Module 100Pin MOC
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