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MIXA450PF1200TSF
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MIXA450PF1200TSF
Phase leg + free wheeling Diodes + NTC
XPT IGBT Module
5
6
4
12 8 7
10/11
3
9
Part number
MIXA450PF1200TSF
Backside: isolated
C25
CE(sat)
VV1.8
CES
650
1200
=
V= V
I= A
2x
Features / Advantages: Applications: Package:
High level of integration - only one
power semiconductor module required
for the whole drive
Rugged XPT design (Xtreme light Punch Through)
results in:
- short circuit rated for 10 µsec.
- very low gate charge
- low EMI
- square RBSOA @ 3x Ic
Thin wafer technology combined with the XPT design
results in a competitive low VCE(sat)
Temperature sense included
SONIC™ diode
- fast and soft reverse recovery
- low operating forward voltage
AC motor drives
Pumps, Fans
Air-conditioning system
Inverter and power supplies
UPS
SimBus F
Industry standard outline
RoHS compliant
Soldering pins for PCB mounting
Height: 17 mm
Base plate: Copper
internally DCB isolated
Advanced power cycling
Isolation Voltage: V~
3000
IXYS reserves the right to change limits, conditions and dimensions.
20121026aData according to IEC 60747and per semiconductor unless otherwise specified
© 2012 IXYS all rights reserved

MIXA450PF1200TSF Documents

IXYS Semiconductor
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MIXA450PF1200 Documents

IXYS Semiconductor
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