Part Datasheet Search > BJTs > ON Semiconductor > MJL21194 Datasheet PDF > MJL21194 Drawing Diagrams Pages 1/2
MJL21194 Drawing Diagrams - ON Semiconductor
| Manufacturer: | ON Semiconductor |
| Category: | BJTs |
| Case Package: | TO-264-3 |
| Description: | TO-3BPL NPN 250V 16A |
| Pictures: |
MJL21194Datasheet PDF
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TO−264, 3−LEAD
CASE 340AJ
ISSUE O
DATE 04 FEB 2013
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES BETWEEN 2.50 AND 3.81
FROM THE LEAD TIP.
4. DIMENSION S APPLIES TO THE MOUNTING HOLE
(∅P). DIMENSION Q APPLIES TO THE NOTCHES
(2X R).
5. THERMAL PAD SIZE AND SHAPE MAY VARY WITH-
IN THE AREA DEFINED BY DIMENSIONS D AND E.
c
R1
A1
Q
Q1
L1
D
L
A
A3
b1
b
4X
5X
0.25
M
AB
S
12
3
E
SCALE 1:2
Y
DIM MIN MAX
MILLIMETERS
D 25.60 26.40
E 19.80 20.20
A 4.80 5.20
A3 2.00 REF
A1 2.50 3.10
b1
e 5.45 BSC
b 0.90 1.25
c 0.50 0.85
Q 5.80 6.20
R 4.00 REF
R1 2.00 REF
S 9.00 BSC
2.50 REF
Y 1.80 REF
XXXXXX = Specific Device Code
A = Assembly Location
YY = Year
WW = Work Week
G = Pb−Free Package
XXXXXX
AYYWWG
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
B
2X
2X
2X
R
2X
2X
b2
e
TOP VIEW
SIDE VIEW
A
0.25
M
AB
S
S
P
b2
3.00 REF
P 3.10 3.50
L1 2.30 2.70
L 16.80 18.20
Q1 8.80 9.20
C
C
BOTTOM VIEW
NOTE 5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON86553E
ON SEMICONDUCTOR STANDARD
TO−264, 3−LEAD
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
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