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TRF7960RHBRG4Datasheet PDF
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TRF7960
TRF7961
SLOU186F–AUGUST 2006–REVISED AUGUST 2010
www.ti.com
Table 3-1. Terminal Functions (continued)
TERMINAL
TYPE
(1)
DESCRIPTION
NAME NO.
I/O pin for parallel communication
I/O_5 22 BID Strobe out clock for serial communication
Data clock output in direct mode
I/O pin for parallel communication
I/O_6 23 BID MISO for serial communication (SPI)
Serial bit data output in direct mode 1 or sub-carrier signal in direct mode 0
I/O pin for parallel communication.
I/O_7 24 BID
MOSI for serial communication (SPI)
Pulse enable and selection of power down mode. If EN2 is connected to VIN, then VDD_X is
EN2 25 INP active during power down to support the MCU. Pin can also be used for pulse wake-up from
power-down mode.
DATA_CLK 26 INP Clock input for MCU communication (parallel and serial)
Clock for MCU (3.39 / 6.78 / 13.56 MHz) at EN = 1 and EN2 = don't care
SYS_CLK 27 OUT
If EN = 0 and EN2 = 1, then system clock is set to 60 kHz
EN 28 INP Chip enable input (If EN = 0, then chip is in power-down mode).
VSS_D 29 SUP Negative supply for internal digital circuits; normally connected to circuit ground
OSC_OUT 30 OUT Crystal oscillator output
OSC_IN 31 INP Crystal oscillator input
VDD_X 32 OUT Internally regulated supply (2.7 V – 3.4 V) for external circuitry (MCU)
Thermal Pad Connected to circuit ground
3.2 PACKAGING/ORDERING INFORMATION
(1)
PACKAGED DEVICES PACKAGE TYPE
(2)
TRANSPORT MEDIA QUANTITY
TRF7960RHBT Tape and reel 250
RHB-32
TRF7960RHBR Tape and reel 3000
TRF7961RHBT Tape and reel 250
RHB-32
TRF7961RHBR Tape and reel 3000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package .
6 Physical Characteristics Copyright © 2006–2010, Texas Instruments Incorporated
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