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TRF7960RHBRG4Datasheet PDF
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Texas Instruments, Inc. PCN#20160608001
PCN Number:
20160608001
PCN Date:
06/17/2016
Title:
Add Cu as Alternative Wire Base Metal for Selected Device(s)
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
09/17/2016
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire option
for selected devices listed in “Product affected” section below. Devices will remain in current
assembly facilities and there will be no other piece part changes:
Pkg Family
Current Wire
Additional Wire
SOT_6
Au 0.6, 0.8, or 1.0 mils
Cu, 0.8 mils
SOT_3
Au, 1.0 mils
Cu, 1.0 mils
TSSOP
Au, 0.96 mils
Cu, 0.8 mils
TSSOP
Au, 1.3 mils
Cu, 1.3 mils
SOIC
Au, 1.3 mils
Cu, 1.3 mils
QFN
Au, 0.96 mils
Cu, 1.0 mils
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Anticipated impact on Material Declaration
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven from
production data and will be available following the production
release. Upon production release the revised reports can be
obtained from the TI ECO website.
Changes to product identification resulting from this PCN:
None
Product Affected: