Part Datasheet Search > Interface ICs > FTDI Chip > FT232RL-REEL Datasheet PDF > FT232RL-REEL Datasheet Pages 37/47
FT232RL-REEL Datasheet - FTDI Chip
| Manufacturer: | FTDI Chip |
| Category: | Interface ICs |
| Case Package: | SSOP-28 |
| Description: | Interface Bridges, USB to UART, 1.8V, 5.25V, SSOP, 28Pins, -40℃ |
| Pictures: |
FT232RL-REELDatasheet PDF
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Copyright © 2010 Future Technology Devices International Limited 37
Document No.: FT_000053
FT232R USB UART IC Datasheet Version 2.11
Clearance No.: FTDI# 38
9.2 QFN-32 Package Dimensions
Figure 9.2 QFN-32 Package Dimensions
The FT232RQ is supplied in a RoHS compliant leadless QFN-32 package. The package is lead ( Pb ) free,
and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch. The above
mechanical drawing shows the QFN-32 package. All dimensions are in millimetres.
The centre pad on the base of the FT232RQ is not internally connected, and can be left unconnected, or
connected to ground (recommended).
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number.
The code XXXXXXX is the manufacturing LOT code. This only applies to devices manufactured after April
2009.
Indicates Pin #1
(Laser Marked)
FT232RQ
32
25
24
17
169
8
1
YYXX-A
5.000 +/-0.075
5.000 +/-0.075
3.200 +/-0.100
3.200 +/-0.100
0.500
0.250 +/-0.050
0.500 +/-0.050
0.150 Max
Pin #1 ID
0.900 +/
-0.100
0.200
0.050
2
1
3
4
5
6
7
8
23
24
22
21
20
19
18
17
2526272829303132
161514131211109
Note: The pin #1 ID is connected internally to the device’s central
heat sink area . It is recommended to ground the central heat sink
area of the device.
0.200 Min
Dimensions in mm.
Central
Heat Sink
Area
FTDI
XXXXXXX
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