Part Datasheet Search > Microcontrollers > ST Microelectronics > STM8S103K3T6C Datasheet PDF > STM8S103K3T6C Features Description Parametrics Pages 1/24
STM8S103K3T6C Features Description Parametrics - ST Microelectronics
| Manufacturer: | ST Microelectronics |
| Category: | Microcontrollers |
| Case Package: | LQFP-32 |
| Description: | MCU 8Bit STM8 CISC 8KB Flash 3.3V/5V 32Pin LQFP Tray |
| Pictures: |
STM8S103K3T6CDatasheet PDF
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July 2016 DocID025707 Rev 4 1/24
TN1163
Technical note
Description of WLCSP for microcontrollers and
recommendations for its use
Introduction
This document describes the wafer level chip size package (WLCSP) and provides
recommendation on how to use it. Only WLCSP for microcontrollers are described herein.
The competitive market of portable equipment, in particular the mobile phone market, is
driven by the challenging development of highly integrated devices. To allow manufacturers
of portable equipment to minimize the dimension of their devices, STMicroelectronics has
developed WLCSP with reduced size, thickness and weight. The electrical performance of
such components is improved by using shorter connections than in standard plastic
packages such as TSSOP, SSOP or BGA.
The WLCSP family is designed to fulfill the same quality levels and same reliability
performance as standard semiconductor plastic packages. As a consequence these new
WLCSP can be considered as new surface mount devices which are assembled on a
printed circuit board (PCB) without any special or additional process steps. In particular
these packages do not require any extra underfill to increase reliability performance or to
protect the device. These packages are compatible with existing pick-and-place equipment
for board mounting. Only Lead-free RoHS compliant WLCSP are available in mass
production. The packages offered in WLCSP are listed in Table 1.
This document addresses the following topics:
• Package description
• Device marking
• Packing specifications and labeling
• Storage and shipping recommendations
• Soldering assembly recommendations
• Package changes and package quality
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