TYPE | DESCRIPTION |
---|
Mounting Style | Through Hole |
Number of Pins | 3 Pin |
Case/Package | TO-247-3 |
Number of Positions | 3 Position |
Power Dissipation | 227 W |
Breakdown Voltage (Collector to Emitter) | 650 V |
Reverse recovery time | 100 ns |
Input Power (Max) | 227 W |
Operating Temperature (Max) | 175 ℃ |
Operating Temperature (Min) | -40 ℃ |
Power Dissipation (Max) | 227000 mW |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tube |
Operating Temperature | -40℃ ~ 175℃ (TJ) |
Summary of Features:
● Lowest saturation voltage V CE(sat) of only 1.05V
● Low switching losses of 1.6mJ @ 25°C for 30A IGBT
● High thermal stability of electrical parameters - only 2% drift with T j increase from 25°C to 175°C
● Enhanced efficiency for 20% lower switching losses in TO-247 4pin Kelvin-Emitter package
●Benefits:
● Higher efficiency for 50Hz
● Longer lifetime and higher reliability of IGBT
● High design reliability due to stable thermal performance
●Target Applications:
● UPS
● Solar
● Welding
Infineon
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Infineon
Infineon’s new L5 low saturation voltage (V CE(sat)) TRENCHSTOP™ IGBT family has been specifically optimized for low switching frequencies ranging from 50Hz to 20kHz. Optimization of the carrier profile of the innovative 55µm TRENCHSTOP™ 5 thin wafer technology allows to reduce conduction losses to the intrinsically low level – 1.05V for 30A IGBT and 1.1V for 75A IGBT.
Infineon
Infineon’s new L5 low saturation voltage (V CE(sat)) TRENCHSTOP™ IGBT family has been specifically optimized for low switching frequencies ranging from 50Hz to 20kHz. Optimization of the carrier profile of the innovative 55µm TRENCHSTOP™ 5 thin wafer technology allows to reduce conduction losses to the intrinsically low level – 1.05V for 30A IGBT and 1.1V for 75A IGBT.
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