TYPE | DESCRIPTION |
---|
Case/Package | DirectFET™ Isometric MQ |
Description
●The IRF6604 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance charge product in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and process. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.
●• Application Specific MOSFETs
●• Ideal for CPU Core DC-DC Converters
●• Low Conduction Losses
●• Low Switching Losses
●• Low Profile (<0.7 mm)
●• Dual Sided Cooling Compatible
●• Compatible with existing Surface Mount Techniques
International Rectifier
13 Pages / 0.59 MByte
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