| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 36 Pin |
| Supply Voltage (DC) | 3.30 V, 3.60 V (max) |
| Case/Package | MBGA-36 |
| Number of Bits | 8 Bit |
| Access Time | 55 ns |
| Memory Size | 2000000 B |
| Access Time(Max) | 55 ns |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Supply Voltage | 2.5V ~ 3.6V |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Operating Temperature | -40℃ ~ 85℃ (TA) |
SRAM - Asynchronous Memory IC 2Mb (256K x 8) Parallel 55ns 36-TFBGA (6x8)
Integrated Silicon Solution(ISSI)
2 Pages / 0.04 MByte
Integrated Silicon Solution(ISSI)
14 Pages / 0.52 MByte
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 32Pin STSOP-I
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 32Pin TSOP-I
Integrated Silicon Solution(ISSI)
Standard SRAM, 256KX8, 55ns, CMOS, PBGA36, 6 X 8MM, LEAD FREE, MINI, BGA-36
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 32Pin STSOP-I T/R
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 32Pin TSOP-I T/R
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 36Pin TFBGA T/R
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 32Pin STSOP-I T/R
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