| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 6 Pin |
| Voltage Rating (DC) | 12.0 V |
| Capacitance | 250 pF |
| Case/Package | Flip-Chip-6 |
| Halogen Free Status | Halogen Free |
| Breakdown Voltage | 13.7 V |
| Number of Channels | 2 Channel |
| Number of Positions | 6 Position |
| Shielding | No |
| Operating Temperature (Max) | 125 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Size-Length | 1.72 mm |
| Size-Width | 1.22 mm |
| Size-Height | 0.7 mm |
| Operating Temperature | -40℃ ~ 125℃ |
This device is designed for cell phone applications requiring Headset and Speaker Phone, EMI Filtering and ESD Protection. This device offers an intergrated solution in a small package reducing PCB space and cost.
●Features
●---
● |
● Provides EMI Filtering and ESD Protection
● Single IC Offers Cost Saving by Replacing 2 Inductors, 4 Capacitors, and 4 TVs diodes
● Compliance with IEC61000-4-2, (Level 4) 8kV (Contact), 15kV (air)
● Flip-Chip Package
● Moisture Sensitivity Level 1
● ESD Ratings: Machine Model = C, Human Body Model = 3B
● Pb-Free Solder Bumps
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