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THGBMHG6C1LBAU6
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THGBMHG6C1LBAU6 Datasheet PDF - Toshiba

Manufacturer:Toshiba
Case Package:WFBGA-153
Description:8GB NAND 15nm embedded MULTIMEDIA CHIP (EEPROM) (-40℃ to +105℃)
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THGBMHG6C1LBAU6 Datasheet PDF
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THGBMHG6C1LBAU6 Specifications

TYPEDESCRIPTION
Mounting StyleSurface Mount
Number of Pins153 Pin
Case/PackageWFBGA-153
Clock Speed200 MHz
Operating Temperature (Max)105 ℃
Operating Temperature (Min)-40 ℃
Supply Voltage2.7V ~ 3.6V

THGBMHG6C1LBAU6 Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusEnd of Life
PackagingTray
Operating Temperature-40℃ ~ 105℃ (TA)

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