Part Datasheet Search > MOSFETs > ON Semiconductor > FQP30N06L Datasheet PDF > FQP30N06L Notice File Pages 1/29
FQP30N06L Notice File - ON Semiconductor
| Manufacturer: | ON Semiconductor |
| Category: | MOSFETs |
| Case Package: | TO-220-3 |
| Description: | Trans MOSFET N-CH 60V 32A 3Pin(3+Tab) TO-220AB Tube |
| Pictures: |
FQP30N06LDatasheet PDF
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TEM001793 Rev. C Page 1 of 14
Final Product/Process Change Notification
Document #:FPCN22647XJ
Issue Date: 28 October 2019
Title of Change:
Mold Compound Change attributed to an End of Life of Samsung SDI EMC for products in TO-220 package.
Proposed first ship date:
4 February 2020
Contact information:
Contact your local ON Semiconductor Sales Office or <PCN.Support@onsemi.com>
Samples:
Contact your local ON Semiconductor Sales Office or <PCN.Support@onsemi.com> ;
<Bokyun.Seo@onsemi.com> ; <Sariman.T@onsemi.com> ; <JinMan.Song@onsemi.com> ;
<David.Zhu@onsemi.com>;<Raja.Roziah.Rahmat@onsemi.com>;<CheePin.Tay@onsemi.com);
<Khairil.FK@onsemi.com>
Sample requests are to be submitted no later than 30 days from the date of first notification, Initial PCN or Final
PCN, for this change.
Samples delivery timing will be subject to request date, sample quantity and special customer packing/label
requirements.
Additional Reliability Data:
Contact your local ON Semiconductor Sales Office or <Lake.Wang@onsemi.com>
Type of notification:
This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior to
implementation of the change.
ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of
delivery of this notice. To do so, contact <PCN.Support@onsemi.com>
Change Part Identification:
Product with date code 1949 or newer will be assembled with the new mold compound.
Change Category:
Wafer Fab Change
Assembly Change
Test Change
Other
_______________
Change Sub-Category(s):
Manufacturing Site Addition
Manufacturing Site Transfer
Manufacturing Process Change
Material Change
Product specific change
Datasheet/Product Doc change
Shipping/Packaging/Marking
Other:
____________________
Sites Affected:
ON Semiconductor Sites:
ON Suzhou, China
External Foundry/Subcon Sites:
NA
Description and Purpose:
ON Semiconductor wishes to inform our customers of a change in mold compounds used for the devices listed in this PCN. This change is a result
of an End of Life notification received from Samsung for several of their SDI Mold Compounds.
Due to the discontinuance of the SDI mold compounds, ON Semiconductor will only have limited supplies of the existing material and in some
cases this may not allow for the normal change notification period.
All other aspects of the impacted products (form, fit, function) will remain unchanged.
Before Change Description
After Change Description
Mold Compound
SI7200DX2; Supplier: Samsung SDI
KTMC1050GFB, Supplier : KCC
Mold Compound
SG8200DL; Supplier: Samsung SDI
KTMC1050GFB, Supplier : KCC
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